vastly experienced Testing and Packaging Team, already preparing
for the sub-half micron era, is dedicated to helping customers
get ahead of competition. Our team offers a fully array of services
including wafer probing, packaging, and final testing; and can
assist customer with both new production R&D and yield improvement.
Both wafer and package testing services are available from Samsung,
for memory, logic and mixed-mode products. These services provide
a total testing solution for our customers, from test program
development to wafer and package testing. Among the advanced testing
procedures implemented at Samsung are automated test data collection
for engineering analysis.
- Wafer Probing :
- Available UV Erase and Laser
- Provide Wafer Map and Lot
- Package Test (Final Test) : High/Room/Cold
- Test Program : Development / Conversion
- Tester Available :
- Memory Tester:Advantest, Credence
- Logic Tester:Credence, HP,
LTX Schlumberger ...etc.
- Mixed Tester:Credence, LTX
Assembly Service for quick turn prototypes
and high volume plastic assembly through qualified subcontractors.
We offer most plastic packages with high quality, short cycle
time, and competitive pricing.