to broaden its exposure to the consumer electronics
market, Tessera Technologies Inc. has expanded an
existing agreement to license semiconductor packaging
technology to Sharp Corp.
Sharp uses Tessera's
technology to package many types of semiconductor
devices, such as Flash memory and Flash and SRAM
stacked combinations, both markets in which Sharp is
considered an industry leader, as well as application
integrated circuits (ASICs) and logic devices. Sharp
incorporates these semiconductors into consumer
products, including personal digital assistants,
digital still cameras, video cameras and mobile
technology available to Sharp under the expanded
agreement covers a broad range of CSP and MCP types,
including ICs in face-down, face-up, fold-over,
stacked and SiP formats. The packages are based on
either tape or laminate substrates.
pleased to have reached an agreement that has much
broader license terms with Sharp, a company broadly
recognized as a leading packaging innovator. As a
result of this agreement, we are increasing Tessera's
penetration in the consumer electronics market,"
said Kirk Flatow, Tessera's senior VP, marketing and
sales, in a statement.